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Application(应用)
Metal Etching, DSP+ Liquid Film PR Stripper Backside Etching
Thin Wafer Etching with Bernoulli Chuck
Performance(工艺)
PA adder, <10ea @ 0.2um u% <3% of metal etching
SECS GEM, RMS, iEMS, FDC
Scheduler
Advantage(竞争优势)
>97% Chemical Recycle Rate Max 4 chemicals in one chamber
Modularized Platform for 200/300mm Wafer
Safety(安全)
Semi S2/S6/F47 Certification
FM approval material and CO2 fire extinguisher Interlock Matrix Control
Application(应用)
Metal Etching, DSP+ Liquid Film PR Stripper Backside Etching
Thin Wafer Etching with Bernoulli Chuck
Performance(工艺)
PA adder, <10ea @ 0.2um u% <3% of metal etching
SECS GEM, RMS, iEMS, FDC
Scheduler
Advantage(竞争优势)
>97% Chemical Recycle Rate Max 4 chemicals in one chamber
Modularized Platform for 200/300mm Wafer
Safety(安全)
Semi S2/S6/F47 Certification
FM approval material and CO2 fire extinguisher Interlock Matrix Control
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